ECSE-4260 “PHYSICAL DESIGN IN MICROELECTRONICS”
Rensselaer Polytechnic Institute
Course Supervisor: Prof. Y.L. Le Coz (lecozy@rpi.edu)
Welcome!—This site serves as an information resource for both prospective
and current students. Important links and actual course materials are available
at end of this page.
Catalog Description— A capstone design course. The conversion
of circuit schematics to integrated-circuit chip layouts. Emphasis is on integrated
circuits, device design, and the electrical performance of interconnected
devices. Projects will involve the use of CAD software for process simulation,
electrical analysis, physical placement, and interconnect routing. Prerequisites:
ECSE-2050 Analog Electronics or ECSE-2060 Digital Electronics, and ECSE-2610
Computer Components and Operations. Corequisite: Senior Standing, ECSE-2210
Microelectronics Technology, and ENGR-4010 Professional Development III. Recommended:
ECSE-4220 VLSI Design. Spring term annually.
3 credit hours.
Course Goal—The course goal is to provide a
practical, culminating (“capstone”) experience in microelectronics physical
design (device and circuit simulation, chip layout, and simulated performance
verification). Familiarity is gained using a variety of industry-grade CAD
tools in the context of a single, semester-long design project. The ability to
work in teams, and to effectively convey technical results, both by oral
presentation and written communication is emphasized. Students are required to
furnish three written documents [individual proposal; mid-term report
(including a consolidated team proposal); and final report]. They are also must
deliver two formal oral presentations, towards the middle and end of semester.
This
primarily self-directed course builds upon the knowledge and skills that the
students have gained from other engineering and professional development
courses in their curriculum. It provides
a culminating experience to practice necessary steps in an industrial microelectronics
design environment—the heavy use of CAD software for device and circuit
simulation, chip layout, and simulated performance verification.
Course Organization—The course is organized as an initial
series of several introductory lectures defining a large “system”—parts of
which need be designed by various teams of students during the semester. Weekly
meetings are set up between the instructor and individual student teams to
assess progress and planning. These meetings are meant to “simulate” those in industry,
where the instructor plays the role of a “technical group leader” or “project
manager”, and the student “engineers”. Also, once a week, a less-formal open
shop is held, during which the instructor and teaching assistant are available
for informal consultation and help. Students themselves are encouraged to have
separate meetings among members of their team, for organization and
coordination. Students are expected, in addition, to accomplish a significant
portion of their activities (research, writing, computer simulation, team
meetings) outside scheduled class time.
Project Description—The electronic synthesis of music
presents a broad technical challenge to the integrated-circuit designer. This
project entails the design of a high-quality digital-to-analog music-synthesis
system. The project breaks down into several components, or electronic
“sub-blocks”, which each have to be designed and interfaced to form the
“whole”. The basic sub-blocks consist of a parallel FIFO buffer connected to
computer mass-storage device, a high-resolution DAC (digital-to-analog
converter), a deglitcher and slew eliminator, a sharp low-pass filter, and a
stable clock oscillator with digitally programmable frequency. Students are
expected to work in teams to design, simulate, and assess. All students will be
assumed to be proficient in LogicWorks™ and SPICE™ CAD packages (no software
training is furnished in this design-oriented course). The latter physical
design objective targets only those students who have used Cadence™ software
tools in previous courses; layout, physical placement, and routing of chip
circuitry are thus allowed options, as well, for them. All students will be
required to organize and form teams, and specialists within, to initially
establish functional logic blocks, including input and output interface
specifications. This approach permits “compartmentalization” for simultaneous
design within and among the teams in the course. Each and every student will
also be required to design, simulate, and verify a portion of their logic
block(s)—at both the boolean (LogicWorks) and transistor (SPICE) level. It is
expected that students will perform mathematical calculations to achieve
understanding before and after using CAD software. Note, as well, students will
be asked to select and define professional and ethical issues relating to their
design and its possible future commercialization. This design project is term
long and open ended. Students must satisfy listed prerequisites and
co-requisites cited in the official RPI Course Catalog Description for
ECSE-4260.
RPI Writing Center (This course is “Writing Intensive”. You will be required to
pass all your draft copy through the Writing Center prior to final submission.
There is a wealth of information here, that you are expected to review!)
Scientific
Abbreviations (Addendum to Final Report Guidelines)