Selected Participations and Events:
Year 2009:
Feb. 13:
Submission a journal paper for an ERC project. Congrads to Jun!
Jun Liao, Ali Mirvakili, Anatoliy Boryssenko, Valencia Joyner, Z.Rena
Huang, “Packaging of PIN photodiode on patch antenna for a dual-mode RF/FSO
receiver”, submitted to IEEE Transactions on Advanced Packaging, Feb, 2010.
Feb. 5-6:
Success in participation in the Industrial Day at Boston University. Thanks to
Jun for presenting a poster at BU. Many complements received from industrial
participants.
Year 2008:
Nov. 13: A journal paper on an ERC project
is accepted for publication. Congrads to Jun! The paper will appear in middle of 2010.
Jun Liao, Juan
Zeng, Shengling Deng, Anatoliy Boryssenko,
Valencia Joyner, Z. Rena Huang, “Packaging of dual-mode wireless communication
module using RF/optoelectronic devices with shared functional components”, in
print by IEEE Transactions on Advanced Packaging, 2009.
Sept. 25: ERC research planning retreat at
RPI
Sept. 10-20: Submit project summary to ERC
interim director and testbed leader (Professor Tom
Little), and discuss project details with them.
July 30: attend RPI investigator meeting
June 24-25: participate in NSF year 1
review, and present a poster for NSF site visit at RPI
January – March: participate in ERC weekly
teleconference of the communication thrust; give oral presentation