· Jun Liao, Ali Mirvakili, Anatoliy Boryssenko, Valencia Joyner, Z.Rena Huang, “Packaging of PIN photodiode on patch antenna for a dual-mode RF/FSO receiver”, submitted to IEEE Transactions on Advanced Packaging, Feb, 2010.

· Jun Liao, Juan Zeng, Shengling Deng, Anatoliy Boryssenko, Valencia Joyner, Z. Rena Huang, “Packaging of dual-mode wireless communication module using RF/optoelectronic devices with shared functional components”, in print at IEEE Transactions on Advanced Packaging, 2009.

· Anatoliy O. Boryssenko, Jun Liao, Juan Zeng, Shengling Deng, Valencia Joyner, Z. Rena Huang, “Radio-optical dual-mode communication modules integrated with planar antennas, In print by IEEE Trans. on microwave theory technology, 2009.

· Benjamin Clough, David Hurley, Pengyu Han, Jun Liao, Z. Rena Huang, X. –C. Zhang, “A Method for detection of Terahertz pulses using Sagnac interferometry”, An International J. of Sensing and Imaging, DOI 10.1007/s11220-009-0046-x, pp55-62, July 2009.

· J. Liao, J. Zeng, S.Deng, V. Joyner, A. Boryssenko, K. Connor, Z. Rena Huang, “Packaging of optoelectronic and RF components with shared elements for dual-mode wireless communications”, Electronics Letters, Volume 45, Issue 8, pp. 411-412, April 2009. pdf

· T. Zhang, R. Micheloni, J.-Q. Lu, and Z. R. Huang, “3D Storage, Power Delivery and RF/Optical Transceiver - Case Studies of 3D Integration from System Design Perspectives”, Proceedings of the IEEE (special issue on 3D Integration Technology), invited, to appear 2008.

· Jun Liao, Shengling Deng, Kenneth Connor, Z. Rena Huang, “Antenna Integration with Laser Diodes and Photodetectors for a Miniaturized Dual-mode Wireless Transceiver”, accepted by 58^th Electronic Component Technology Conference (ECTC) at Orlando, 2008

· Zhaoran Rena Huang, Daniel Guidotti, Lixi Wan, Yin-Jung Chang, Jianjun Yu, Jin Liu, Hung-Fei Kuo, Gee-Kung Chang, Fuhan Liu and Rao Tummala, “Hybrid integration of end-to-end optical interconnects on printed circuit boards”, IEEE Trans. on Comp. and Packaging Tech., pp. 708-716, Dec. 2007. pdf

· Jun Liao, Shengling Deng, Fay Smith Z. Rena Huang, Kenneth Connor, “Integrated Laser Diodes and Photodetectors with Antenna for Dual-Mode Wireless Communication”, IEEE 20^th LEOS Annual meeting, pp. 264-265, Orlando, October, 2007 pdf

· Shengling Deng, Jun Liao, Z. Rena Huang, Mona Hella, Kenneth Connor, “Wireless Connections of a Sensor Network using RF and Free Space Optical Links”, SPIE East conference, Boston, September, 2007 pdf

· Mingyuan Zhao, Z. Rena Huang, “Modeling of Microchannel Fluid Cooling for Silicon Chips”, IEEE 57^th Electronic Component Technology Conference (ECTC), pp. 2017-2023, Reno, May 2007 pdf

· M. Mital, M.Y. Zhao, E.P. Scott, and Rena Huang, "Thermal design and optimization of a microchannel cooled integrated power electronic module," 9th AIAA/ASME Joint Thermophysics and Heat Transfer Conference, San Francisco, California, June 5-8, 2006.

· M. Zhao, M. Mital, Z. R. Huang, E. Scott, Z. Liang, J.D. Van Wyk, “Thermal modeling of IPEM using microchannel cooling”, CPES Proceeding, April, 2006

· Zhaoran Rena Huang, “High density, end-to-end optoelectronic integration and packaging for high speed interconnect systems”. 14th Annual CMOS symposium, March 17, 2005.

· GK Chang, Dan Guidotti, Z. Rena Huang, Lixi Wan, Jianjun Yu, Shashikant Hegde, Hung-Fei Kuo, Yin-Jung Chang, Fuhan Liu, Fentao Wang and Rao Tummala, “High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems”, SPIE 5814-24, pp 176-190, 2005 pdf

· Dan Guidotti, Fuhan Liu, Yin-Jung Chang, Zhaoran Huang, Jin Liu and Gee-Kung Chang, “Chip-to-chip optoelectronics SOP on organic boards for packages. IEEE Trans. on Adv. Packaging, Vol. 27, pp386-397, 2004. pdf

· R. Tummala, M. Swaminathan, M. Tentzeris, J. Laskar, G.K. Chang, S. Sitaraman, D. Keezer, D. Guidotti, Z. Huang, K. Kim, L. Wan, S. Bhattacharya, V. Sundaram, F. Liu, and P. M. Raj, “The SOP for miniaturized, mixed-signal computing communication, and consumer systems of the next decade”, IEEE Trans. on Advanced Packaging, Vol. 27, May 2004 pdf

· Zhaoran Huang, Daniel Guidotti, Gee-Kung Chang, Jin Liu, Fuhan Liu, Y-J Chang, and Rao Tummala, “Optical interconnects integration on FR4 board with MSM Photodetector and Commercial Optoelectronic Devices”, LEOS summer topical meeting, San Diego, June, pp13-14, 2004. pdf

· Fuhan liu, Rao, Tummala, Venky Sundaram, Daniel Guidotti, Zhaoran Huang, Y-J Chang, Isaac Robin Abothu, P M Raj, Swapan Bhattacharya, Devarajan Balaraman, GK Chang, “Multifunctional integrated substrate technology for high density SOP packaging”, 6^th IEEE CPMT Conf. on High Density Microsystem and Packaging (HDP’04), China, June, 2004. pdf

· Fuhan Liu, Daniel Guidotti, Venkatesh Sundaram, Saru Mahajan, Zhaoran Huang, Yin-Jung Chang, G. K. Chang, and Rao Tummala, “Material and process challenges in Embedding polymeric waveguide and detectors in system on packages (SOP)”, Proceedings of 9^th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp 89-94, March, 2004.

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