·        Shengling Deng, Z. Rena Huang, J. R. Guo, J. F. McDonald, and Russ P. Kraft, “Numerical Investigation of a SiGe HBT Electro-Optic Modulator”, Proceedings of IEEE Winter Topicals at Austria, January, pp.14-15, 2009

 

·        Zhaoran Rena Huang, Daniel Guidotti, Lixi Wan, Yin-Jung Chang, Jianjun Yu, Jin Liu, Hung-Fei Kuo, Gee-Kung Chang, Fuhan Liu and Rao Tummala, “Hybrid integration of end-to-end optical interconnects on printed circuit boards”, IEEE Trans. on Comp. and Packaging Tech., pp. 708-716, Dec. 2007. pdf

 

·        Jiguang Li, Z. Rena Huang, “Low loss photonic crystal waveguide by elliptical unit cell structure” IEEE 19th LEOS annual meeting, pp. 827-828, Oct. 29-Nov. 2, Montreal, 2006 pdf

 

·        Z. Rena Huang, Jiguang Li, “Vertical evanescent coupling from channel waveguide to photonic crystal waveguide”, SPIE, Great Lakes Photonics Symposium, June 12-16, 2006.

 

·        GK Chang, Dan Guidotti, Z. Rena Huang, Lixi Wan, Jianjun Yu, Shashikant Hegde, Hung-Fei Kuo, Yin-Jung Chang, Fuhan Liu, Fentao Wang and Rao Tummala, “High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems”, SPIE 5814-24, pp 176-190, 2005 pdf

 

·        Zhaoran Huang, Daniel Guidotti, Gee-Kung Chang, Jin Liu, Fuhan Liu, Y-J Chang, and Rao Tummala, “Optical interconnects integration on FR4 board with MSM Photodetector and Commercial Optoelectronic Devices”, LEOS summer topical meeting, San Diego, June, pp13-14, 2004. pdf

 

·        Fuhan Liu, Daniel Guidotti, Venkatesh Sundaram, Saru Mahajan, Zhaoran Huang, Yin-Jung Chang, G. K. Chang, and Rao Tummala, “Material and process challenges in Embedding polymeric waveguide and detectors in system on packages (SOP)”, Proceedings of 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, pp 89-94, March, 2004.

 

The material on this web page is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.