TECHNICAL PROGRAM COMMITTEE
High voltage:
 

H.R. Chang

International Rectifier, USA

 
  A. Agarwal Cree, USA  
  V. Benda Czech Technical University, Czech Republic  
  P. Chow Rensselaer Polytechnic Institute, USA  
  M.K. Han Seoul National University, Korea  
  Reinhard Herzer Semikron, Germany  
  M. Hoshi Nissan, Japan  
  H. Iwamoto Melco, Japan  
  T. Kimoto Kyoto University, Japan  
  D. Kinzer Fairchild, USA  
  S. Linder ABB, Switzerland  
  L. Lorenz Infineon Technologies, Germany  
  P. Mawby University of Wales Swansea, UK  
  J. Millan CNM, Spain  
  M. Mori Hitachi, Japan  
  D. Pattanayak Vishay-Siliconix, USA  
  J.-L. Sanchez LAAS-CNRS, France  
  Y. Seki Fuji Hitachi Power Semiconductor, Japan  
  David Sheridan SemiSouth, USA  
  R. Sittig Braunschweig Institute of Electrophysics, Germany  
  P. Spirito University of Naples, Italy  
  Y. Sugawara Kansai Electric Power, Japan  
  S. Yoshida Furukawa, Japan  
Integrated power:
  D. Disney Advanced Analogic Technologies, USA  
  H. Akagi Tokyo Inst. of Technology, Japan  
  S. Banerjee Power Integrations, USA  
  C. Contiero STMicroelectronics, Italy  
  W. Fichtner Swiss Federal Institute of Technology, Swiss  
  A. Huang N. Carolina State University, USA  
  T. Letavic Philips, USA  
  S. Ekkanath Madathil De Montfort University, UK  
  G. Majumdar Mitsubishi, Japan  
  P. Moens AMI Semiconductor, Belgium  
  W.T. Ng University of Toronto, Canada  
  S. Pendharkar Texas Instruments, USA  
  A. Shibib International Rectifier, USA  
  D. Silber University of Bremen, Germany  
  J. Sin Hong Kong University of Science and Technology, China  
  H. Tadano Toyota, Japan  
  R. Zhu Freescale Semiconductor, USA  
Low voltage & RF:
  G . Dolny Fairchild Semiconductor, USA  
  R. van Dalen NXP Semiconductors, Belgium  
  M. Darwish Maxpower Semiconductor, USA  
  P. Hower Texas Instruments, USA  
  V. Khemka Freescale Semiconductor, USA  
  S. Matsumoto NTT, Japan  
  A. Nakagawa Toshiba, Japan  
  A. Salama University of Toronto, Canada  
  J. Shen University of Central Florida, USA  
  A. Strachan National Semiconductor, USA  
  A. Sugai Shindengen Electric, Japan  
  A. Tamagawa NEC Electronics, Japan  
  F. Udrea Cambridge University, UK  
  T. Yachi Tokyo University of Science, Japan  
  I. Yoshida Renesas, Japan