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Zhaoran (Rena) Huang
Assistant Professor
Electrical, Computer and Systems Engineering Dept.
Rensselaer Polytechnic Institute
Troy, New York 12180-3590
Office: CII 6207
Tel: (518) 276-6086 Fax: (518) 276-8761
E - Mail: huangz3 at rpi.edu
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Mailing address:
Prof. Zhaoran (Rena) Huang
CII 6207
Rensselaer Polytechnic Institute
110 8th
St,
Troy, NY 12180-3590
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Biography
Zhaoran (Rena) Huang joined the
faculty of the department of Electrical, Computer and Systems Engineering as an
Assistant Professor at Rensselaer Polytechnic Institute in October 2004. She
earned her Ph.D. in Electrical Engineering from School of Electrical
and Computer Engineering of Georgia Institute of Technology in December 2003.
During her Ph.D., she focused on integration of high speed optical
interconnection using thin film semiconductor devices. She has worked for Microsystem Packaging Research Center
from January 2004 to September 2004 where she explored the design and
integration of end-to-end Optical Interconnection on SOP.
Teaching and Advising:
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ECSE-2210:
Microelectronics Technology (Fall-04, Spring-05,06, Fall-07,08)
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ECSE-6964:
Optoelectronics: Device, Integration and Packaging (Fall-05)
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ECSE/PHYS-4630: Lasers and Optical Systems (Spring-07,08,09)
Office hour: open door policy or by appointment
Research Interests and Current Research Topics:
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Electronic
(optoelectronic and RF) Integration and Packaging Click
here for publications
RF and Free-Space
Optics are two complementary wireless communication technologies. We conduct
concurrent design and integration of optical components with RF antennas to
create a dual-channel RF/FSO package for wireless communication. We also
explore monolithic integrated RF/Opto devices on Si, GaAs and InP substrates.
We have invented
double-sided fluidic microchannel cooling structure for miniaturized on-chip
heat dissipation. We developed a unique technique to fabricate embedded
microchannels using sacrificial polymer on semiconductor substrate. In the
past, we also conducted research on the integration of bare die electronic
devices on PCB board for low-cost mixed signal package.
Thin film
optoelectronic devices: Expitaxial layer lift-off technique has been developed to remove the growth
substrate of solid state device. This technique has been successfully applied
to InGaAs on InP substrate, obtaining photodetector at a thickness of ~
1μm. We also demonstrated hybrid integration of thin film photodetectors
onto dissimilar substrates (Si, SiO2, ceramic, and PCB boards) that
are embedded in polymer waveguide for high-speed optical interconnect and clock
distribution.
Metal-semiconductor-metal
(MSM) photodetector: MSM
photodetector is particularly attractive because it has much lower unit area
capacitance than pin photodiode. MSM is a planar device, simple in fabrication,
and compatible with FET processing. In our group, we study the Schottky contact
physics and explore the carrier drift in complex structures that involve 3D
spatial modulation. The goal of the research is to design and fabricate MSM
that operates at low bias voltage (<2V) and high bandwidth (>10GHz).
APSYS from Crosslight is used for the exploration of the device physics.
Arrayed PDs for
image sensor: Planar
photodetector arrays are explored for image sensors that require high filling
factor (>80%) and massive data parallel processing. In our research, the PD
arrays are heterogeneously integrated with the electronic chips through 3D
wafer bonding process. The device fabrication and integration is performed in
the RPI cleanroom.
Low loss
photonic crystal waveguide: Photonic crystal waveguide has higher propagation loss compared to an
index-guided conventional optical waveguide. We discovered that elliptical
photonic crystal waveguides with broken symmetry exhibit improved propagation
loss.
Optical
waveguide for biosensor applications: High index contrast optical waveguide is explored
for bio-sensor application.
Patents:
Pending: “Integrated
Thin Film MSM Photodetector/Gratings for WDM” (#US20070041679)
Awards:
2004 IEEE Transactions on Advanced Packaging
Commendable Paper Award
2003 Outstanding Poster Paper Award of the 53th Electronic
Components Technology Conference (ECTC)
2000 Georgia Tech PRC Outstanding Poster Award
Students:
Jun Liao
Shengling Deng
Joseph
Novak
Alumni:
Mingyuan Zhao (NXP Semiconductor)
Jiguang
Li (Master)
Fay Smith (Rockwell Collins)
Others:
Book list