|
|
|
|
|
Sponsors
We
gratefully acknowledge the support from the following funding agencies and
companies.
The 3D wafer level integration
platform is partially supported through the Interconnect Focus Center (IFC) for
Hyper-integration, funded by MARCO, DARPA and NYSTAR
[RPI][School of Engineering] [ECSE]
©
2006 Rensselaer Polytechnic Institute. All Rights Reserved
Electrical, Computer, and Systems Engineering Department
Rensselaer Polytechnic Institute -