For the latest news from the Center for Broadband Data Transport Science and Technology, click on a link below. This site will feature stories from Rensselaer Polytechnic Institute's Office of Communications or from other Center institutions. Pertinent articles from local, national, or international media outlets may also be posted. Check back frequently for updates. Click Here

First topical meeting of the RPI Broadband Center for Data Communications

Packaging/Processing Topical Meeting Agenda

Introductions and Research  Overview – Marc Taubenblatt (IBM)
10:30-10:45 Welcome – T.C. Chen, VP Science and Technology (IBM)
10:45-11:05 John Magerlein (IBM – MEMS of Resonators and Switches Compatible with Bi-CMOS Processing
11:05-11:25 Prof. Ronald Guttman (RPI) – A 3D IC Technology Platform: Current Status and Future Directions
11:25-11:45 Paul Andry (IBM) – Silicon-Based System on Package Concepts
11:45-12:05 Prof. Kevin Kornegay (Cornell) – An Overview of Packaging and Device Processing Research at Cornell
12:05 -12:30 Lunch
12:30-12:50 Prof. Eric Eisenbaum/Prof. Bai Xu (U. Albany) – Multi-Dimensional Integration: Cross-Disciplinary Challenges
12:50-1:10 Prof. Peter Persans (RPI) – Low Temperature Processing for Optical Interconnect Waveguide Components
1:10-1:30 Steve Buchwalter (IBM) – Understanding Reliability of Microelectronic Packaging
1:30-1:45 Ron Nunes (IBM) – Overview of Electro-Optic Packaging Line
1:45-2:45 Tour of Electro-Optic Packaging  Line (University visitors only)
2:45-3:00 Post Tour Discussion/Questions        
3:00-4:00 Discussion/Potential interactions, proposals (ALL)
4:00-4:15 Wrap up

First Topical Meeting Organizer:
Dr. Marc A. Taubenblatt
Sr. Mgr, Optical Communications and High Speed Test
Communications R&D Ctr.
P.O. Box 218 M/S 37-142
Yorktown Heights, NY 10598
914-945-3819 FAX 914-945-1974
Assistant: Lisa Calabro 914-945-3356


Back to Top