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First topical meeting of the RPI Broadband Center for Data Communications

Packaging/Processing Topical Meeting Agenda

10:00-10:30
Introductions and Research  Overview – Marc Taubenblatt (IBM)
10:30-10:45 Welcome – T.C. Chen, VP Science and Technology (IBM)
10:45-11:05 John Magerlein (IBM – MEMS of Resonators and Switches Compatible with Bi-CMOS Processing
11:05-11:25 Prof. Ronald Guttman (RPI) – A 3D IC Technology Platform: Current Status and Future Directions
11:25-11:45 Paul Andry (IBM) – Silicon-Based System on Package Concepts
11:45-12:05 Prof. Kevin Kornegay (Cornell) – An Overview of Packaging and Device Processing Research at Cornell
12:05 -12:30 Lunch
12:30-12:50 Prof. Eric Eisenbaum/Prof. Bai Xu (U. Albany) – Multi-Dimensional Integration: Cross-Disciplinary Challenges
12:50-1:10 Prof. Peter Persans (RPI) – Low Temperature Processing for Optical Interconnect Waveguide Components
1:10-1:30 Steve Buchwalter (IBM) – Understanding Reliability of Microelectronic Packaging
1:30-1:45 Ron Nunes (IBM) – Overview of Electro-Optic Packaging Line
1:45-2:45 Tour of Electro-Optic Packaging  Line (University visitors only)
2:45-3:00 Post Tour Discussion/Questions        
3:00-4:00 Discussion/Potential interactions, proposals (ALL)
4:00-4:15 Wrap up

First Topical Meeting Organizer:
Dr. Marc A. Taubenblatt
Sr. Mgr, Optical Communications and High Speed Test
Communications R&D Ctr.
P.O. Box 218 M/S 37-142
Yorktown Heights, NY 10598
914-945-3819 FAX 914-945-1974
Assistant: Lisa Calabro 914-945-3356

 

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