Rensselaer Polytechnic Institute
Troy,
NY
Electrical, Computer, and
Systems Engineering Department
The
ECSE Dept. gratefully acknowledges the generous support of Cadence Design
Systems through their university program for providing EDA tools used in
classes and several ongoing research efforts within the department.
Classes using Cadence tools:
Electronic
Instrumentation: ENGR-2300 Circuits course for non-EEs, covering
linear RLC circuits, filters, strain gauges & bridges, op amps & Schmitt
triggers, logic gates & flip-flops, diode circuits and steady-state
Laplace transforms with simulations and laboratory exercises |
PSpice, Capture CIS |
Electrical
Circuits: ECSE-2010 First circuits course, covering
linear RLC circuits, controlled sources, op amps, filters and Laplace
transforms with simulations and laboratory exercises |
PSpice, Capture CIS |
Introduction
to Electronics: ECSE-2050 Introductory analog electronic
circuit design, analysis and simulation |
PSD, PSpice,
Capture CIS |
VLSI Design:
ECSE-4220 (09/2011) VLSI Design:
ECSE-4220 (11/2003) Introduction to VLSI design - logic
circuit design, layout, simulation, & verification with CMOS devices
using ICFB, LVS, Spectre, & VHDL |
IC, LDV |
Advanced
VLSI Design: ECSE-6680 VLSI design with device modeling
& design for test, SPICE simulation, placement & routing, and high
level design description using ICFB, LVS, Spectre,
& VHDL |
IC, LDV |
VLSI
Design Automation: ECSE-6690 Advanced design with standard cells
& auto routing with BiCMOS HBTs using ICFB, LVS, VHDL, Verilog, Spectre, & ICCraftsman
|
IC, ICC, LDV |
Research Programs using Cadence tools:
Laboratory for Student Exploration
and Innovation (student projects designing analog and digital circuits: PCB
layouts, component pick & place, wave soldering, test instrumentation, ...) |
PSD,
PSpice, Capture CIS |
High speed custom analog and digital
circuit design, layout, parasitic extraction, simulation, verification, &
fabrication with SiGe BiCMOS HBTs using ICFB, LVS, DRC Spectre,
& VHDL |
IC,
ADVIC, LDV |
On-Chip Memory in 2D &
3D Technologies
Design and layout of memory cells for optimized
performance of interconnect and devices in 2 and 3D with MOSFETs using layout
tools, LVS and simulations Monolithic,
Point-of-Load DC-DC Converter (joint with Center for Power Electronics Sys.) Design of high-speed DC-DC converters for power delivery to high
performance ICs using layout tools, LVS and simulations |
IC |
Electrical
Impedance Tomography Developing circuit boards for a series
of non-invasive medical imaging devices, Adaptive Current Tomographs
(ACT), which produce images of the interior of the
body from electrical measurements made using electrodes placed on its surface |
PSD |
Center for Power Electronics
Systems Designing masks and models for
simulation and fabrication of Si and SiC power
devices using ICFB |
IC |
SiGe
High-Performance A/D Conversion Design and fabrication of high-resolution,
high-performance analog to digital converters and operational transconductance amplifiers with SiGe BiCMOS technology
using layout tools, LVS, simulations and DRC |
IC,
LDV |
This
site is maintained by Russell Kraft, (e-mail: ).
Last
updated July 30, 2019
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