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Cadence® University Program Member

The ECSE Dept. gratefully acknowledges the generous support of Cadence Design Systems through their university program for providing EDA tools used in classes and several ongoing research efforts within the department.

Classes using Cadence tools:

Electronic Instrumentation: ENGR-2300 Circuits course for non-EEs, covering linear RLC circuits, filters, strain gauges & bridges, op amps & Schmitt triggers, logic gates & flip-flops, diode circuits and steady-state Laplace transforms with simulations and laboratory exercises	PSpice, Capture CIS
Electrical Circuits: ECSE-2010 First circuits course, covering linear RLC circuits, controlled sources, op amps, filters and Laplace transforms with simulations and laboratory exercises	PSpice, Capture CIS
Introduction to Electronics: ECSE-2050 Introductory analog electronic circuit design, analysis and simulation	PSD, PSpice, Capture CIS
VLSI Design: ECSE-4220 (09/2011) VLSI Design: ECSE-4220 (11/2003) Introduction to VLSI design - logic circuit design, layout, simulation, & verification with CMOS devices using ICFB, LVS, Spectre, & VHDL	IC, LDV
Advanced VLSI Design: ECSE-6680 VLSI design with device modeling & design for test, SPICE simulation, placement & routing, and high level design description using ICFB, LVS, Spectre, & VHDL	IC, LDV
VLSI Design Automation: ECSE-6690 Advanced design with standard cells & auto routing with BiCMOS HBTs using ICFB, LVS, VHDL, Verilog, Spectre, & ICCraftsman	IC, ICC, LDV

Research Programs using Cadence tools:

Douglas Mercer '77 Laboratory Laboratory for Student Exploration and Innovation (student projects designing analog and digital circuits: PCB layouts, component pick & place, wave soldering, test instrumentation, ...)	PSD, PSpice, Capture CIS
SiGe Design Group High speed custom analog and digital circuit design, layout, parasitic extraction, simulation, verification, & fabrication with SiGe BiCMOS HBTs using ICFB, LVS, DRC Spectre, & VHDL	IC, ADVIC, LDV
Interconnect Focus Center On-Chip Memory in 2D & 3D Technologies Design and layout of memory cells for optimized performance of interconnect and devices in 2 and 3D with MOSFETs using layout tools, LVS and simulations Monolithic, Point-of-Load DC-DC Converter (joint with Center for Power Electronics Sys.) Design of high-speed DC-DC converters for power delivery to high performance ICs using layout tools, LVS and simulations	IC
Electrical Impedance Tomography Developing circuit boards for a series of non-invasive medical imaging devices, Adaptive Current Tomographs (ACT), which produce images of the interior of the body from electrical measurements made using electrodes placed on its surface	PSD
Center for Power Electronics Systems Designing masks and models for simulation and fabrication of Si and SiC power devices using ICFB	IC
SiGe High-Performance A/D Conversion Design and fabrication of high-resolution, high-performance analog to digital converters and operational transconductance amplifiers with SiGe BiCMOS technology using layout tools, LVS, simulations and DRC	IC, LDV

This site is maintained by Russell Kraft, (e-mail: ).

Last updated July 30, 2019

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Cadence® University Program Member

Advanced design with standard cells & auto routing with BiCMOS HBTs using ICFB, LVS, VHDL, Verilog, Spectre, & ICCraftsman

On-Chip Memory in 2D & 3D Technologies

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