HSCD Test Reticle

Principal Investigator: Prof. John F. McDonald
Center for Integrated Electronics and Electronics Manufacturing
Rensselaer Polytechnic Institute
Troy, NY-12180

Other Participants

Rockwell International Corporation
IBM Corporation
Cadence Design Systems Inc.


First HSCD HBT Reticle

Click on the picture below to see individual chips...



Die Sites Identification Map


Introduction


This page is still under construction. Send your suggestions to Atul Garg. (Last updated Mar 27, 1995)