Slide 11 of 64
This is a pictorial representation of the GE/HDI multichip package to be used to integrate the 24 chip architecture. The dimensions of the substrate are approximately 7 cm by 3 cm. The key point to notice is that the GE/HDI package provides transmission line quality interconnections whereby signals can be communicated between the chips at the speed of light in a low K polyimide dielectric insulator. These interconnections perform much better than the Au/polyimide interconnections on the chip because of the large wire cross sections in the MCM, which gives 7ps/mm propagation delay and > 40 GHz bandwidth.