Slide 12 of 64
This slide shows the artwork for the GE/HDI multichip package interconnection tape. Also shown are the power rings and edge mounted SMA connectors for testing the package. Testing at GHz speeds requires special consideration. All chips have had to be designed with a special boundary scan (BS) at speed testing circuit which also operates when the chips are co-mounted in the MCM. Only a few signals are needed for communication to the boundary scan test circuitry at the 2 GHz rate.