Slide 13 of 64
This shows a sample submodule of a mother daughter board GE/HDI MCM. One can see the chips directly through the tape because the chips go into the package first, then the interconnection tape is laid down on the top. The mother daughter board strategy is designed to permit population of smaller submodules with fewer chips inserted. These daughter MCMs are then integrated into the mother board. Testing of the chips is performed repeatedly at several points during integration to permit rework without putting all chips at risk.