Slide 25 of 64
This is the thermal analysis provided by Mentor CAD tools for the GE/HDI MCM package. The total dissipation for the test system is 170 watts! This level of heat is a direct result of the large emitter size in GaAs (2 microns emitter stripe as finally fabricated) and the lack of a co-integrated CMOS device for memory. Even in this system the processor exclusive of the L1 cache is only 50 Watts. The remaining 120 watts comes from the cache chips. Future designs must incorporate an L0 cache to provide the speed required while keeping the power level down. L0 would look more like a register file.